Japan begins production: 2 nanometers will change the balance in technology

Japan-based semiconductor company Rapidus has reached a significant milestone in its 2-nanometer (nm) chip fabrication process. The company has officially begun test production of its next-generation Gate-All-Around (GAA) architecture transistors. Production is being conducted at its IIM-1 plant in Chitose.

CRITICAL STEP BEFORE MASS PRODUCTION

It was announced that the 2nm chips obtained in test production met the established technical criteria for electrical performance. Parameters such as threshold voltage, conduction and leakage current, and transition slope were measured. While technical details have not been shared publicly, the inclusion of the test chips in the production line demonstrates the technical success of the R&D process.

PRODUCTION INFRASTRUCTURE HAS BEEN PREPARED SINCE 2023

The foundations for the production infrastructure at the IIM-1 facility were laid in September 2023. Cleanroom construction was completed in 2024, and more than 200 production equipment units, including DUV and EUV lithography machines, were commissioned by June 2025. Installation of the EUV systems was completed in December 2024, and the first production trials were conducted in April 2025.

ALL PLATES WILL BE PROCESSED INDIVIDUALLY

Rapidus's production method is attracting attention in the industry. The company announced that it will implement a "single wafer processing" system across all production steps. In this method, each semiconductor wafer is processed and inspected individually.

While manufacturers such as TSMC, Samsung, and Intel currently use this method only in certain steps, Rapidus aims to perform all processes, including oxidation, ion implantation, and cleaning, with this method.

THERE ARE AS MUCH CHALLENGES AS THE ADVANTAGES

This production system allows for real-time analysis of each plate, early detection of errors, and dynamic optimization of the process. However, the method also has some drawbacks. Prolonged production times, increased costs, and the need for complex equipment are among the notable technical challenges.

Despite this, Rapidus argues that this method will provide a competitive advantage in 2nm and beyond technologies in the long term, thanks to its low error rate, high efficiency and flexible production infrastructure.